Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy

Archaeological Ceramics Studied by Scanning Electron Microscopy

The use of scanning electron microscopy combined with energy dispersive X-ray fluorescence analysis in studies of archaeological pottery is discussed. The methods are described and results of their application to studies of Precolumbian glossy black pottery from northern Peru are reported in some detail.

Adsorption and Reactions of Water on the Copper (110) Surface Studied by Scanning Tunneling Microscopy By

Plasticity mechanism for copper extrusion in through-silicon vias for three- dimensional interconnects

Full elastic strain and stress tensor measurements from individual dislocation cells in copper through-Si vias

Nondestructive measurements of the full elastic strain and stress tensors from individual dislocation cells distributed along the full extent of a 50 µm-long polycrystalline copper via in Si is reported. Determining all of the components of these tensors from sub-micrometre regions within deformed metals presents considerable challenges. The primary issues are ensuring that different diffractio...

Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature

A comprehensive investigation of the surfaces of copper through silicon vias Cu-TSVs and gold stud bumps is presented. These vias and stud bumps were bonded at room temperature using a nanobonding and interconnection equipment. The influence of heating on the bonded interface was also studied. In order to achieve an intimate contact between the Au-stud bumps and Cu-TSVs, the stud bumps were fla...